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Core I7-6820HK SR2FL Laptop CPU Processors , Pc I7 Processor 6MB Cache Up To 3.6GHz

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Core I7-6820HK SR2FL Laptop CPU Processors , Pc I7 Processor 6MB Cache Up To 3.6GHz

Model Number : I7-6820HK SR2FL

Certification : ORIGINAL PARTS

MOQ : 1 piece

Price : Negotiation

Payment Terms : T/T, PayPal, Western Union, Escrow and others

Supply Ability : 500pcs

Delivery Time : 3-5 work days

Packaging Details : tray, 10cmX10cmX5cm

Processorl Number : I7-6820HK

Produce Collection : The 6th Core I7 Series Processor

Code Name : Products formerly Skylake

Vertical Segment : Mobile

Status : Launched

Launch Date : Q3'15

Lithography : 14nm

Use Conditon : Notebook

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Core I7-6820HK SR2FL Laptop CPU Procesors I7 Series 6MB Cache , up to 3.6GHz - Notebook Processor

Core i7-6820HK is a quad-core processor based on the Skylake architecture, that has been launched in September 2015. In addition to four CPU cores with Hyper-Threading clocked at 2.7 - 3.6 GHz (4 cores: max. 3.2 GHz, 2 cores: max. 3.4 GHz), the chip also integrates an HD Graphics 530 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The CPU is manufactured using a 14 nm process with FinFET transistors.

Currently, the i7-6820HK is the only Skylake chip with an unlocked multiplier for easy overclocking (similar to previous Extreme Editions).

Processor number i7-6820HK

Processor number i7-6820HK
Family Core i7 Mobile
Technology (micron) 0.014
Processor speed (GHz) 2.7
L2 cache size (KB) 1024
L3 cache size (MB) 8
The number of cores4 4
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

General Information:

Type CPU / Microprocessor
Market segment Mobile
Family
Intel Core i7 Mobile
Model number
i7-6820HK
CPU part number
  • CL8066202194730 is an OEM/tray microprocessor
Frequency 2700 MHz
Maximum turbo frequency 3600 MHz (1 core)
3400 MHz (2 cores)
3200 MHz (3 or 4 cores)
Bus speed 8 GT/s DMI
Clock multiplier 27
Package 1440-ball micro-FCBGA
Socket BGA1440
Size 1.65" x 1.1" / 4.2cm x 2.8cm
Introduction date September 1, 2015 (announcement)
September 1, 2015 (availability in Asia)
September 27, 2015 (availability elsewhere)

Architecture Microarchiteture:

Microarchitecture Skylake
Processor core Skylake-H
Core stepping R0 (SR2FL)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size 4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size 4 x 256 KB 4-way set associative caches
Level 3 cache size 8 MB 16-way set associative shared cache
Physical memory 64 GB
Multiprocessing Not supported
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • TSX / Transactional Synchronization Extensions
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
Low power features Enhanced SpeedStep technology


Intergrated Peripherals/Components:

Display controller 3 displays
Integrated graphics GPU Type: HD 530
Graphics tier: GT2
Microarchitecture: Gen 9
Execution units: 24
Base frequency (MHz): 350
Maximum frequency (MHz): 1050
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
Other peripherals
  • Direct Media Interface 3.0
  • PCI Express 3.0 interface (16 lanes)


Eletrical/Thermal Parameters:

Maximum operating temperature 100°C
Thermal Design Power 4.5 Watt

Product Tags:

laptop microprocessor

      

laptop chips

      
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