| Processor number | i5-520M |
| Family | Core i5 Mobile |
| Technology (micron) | 0.032 |
| Processor speed (GHz) | 2.4 |
| L2 cache size (KB) | 512 |
| L3 cache size (MB) | 3 |
| The number of cores | 2 |
| EM64T | Supported |
| HyperThreading technology | Supported |
| Virtualization technology | Supported |
| Enhanced SpeedStep technology | Supported |
| Execute-Disable bit feature | Supported |
General information:
|
| Type | CPU / Microprocessor |
| Market segment | Mobile |
| Family | Intel Core i5 Mobile |
| Model number | i5-520M |
| Frequency | 2400 MHz |
| Maximum turbo frequency | 2933 MHz (1 core)
2667 MHz (2 cores) |
| Low power frequency | 1200 MHz |
| Bus speed | 2.5 GT/s DMI |
| Clock multiplier | 18 |
| Package | 988-pin micro-FCPGA (rPGA988A) |
| Socket | Socket G1 / rPGA988A |
| Size | 1.48" x 1.48" / 3.75cm x 3.75cm |
| Introduction date | January 7, 2010 |
| End-of-Life date | Last order date for boxed processors is October 19, 2012
Last shipment date for boxed processors is January 18, 2013 |
| | |
Architecture / Microarchitecture:
|
| Microarchitecture | Westmere |
| Platform | Calpella |
| Processor core | Arrandale |
| Core steppings | C2 (Q3GB, SLBNB)
K0 (Q4CN, SLBU3) |
| CPUIDs | 20652 (Q3GB, SLBNB)
20655 (Q4CN, SLBU3) |
| Manufacturing process | 0.032 micron
382 million transistors (CPU die)
177 million transistors (IMC / graphics die) |
| Die | 81mm2 (CPU die)
114mm2 (IMC / graphics die) |
| Data width | 64 bit |
| The number of CPU cores | 2 |
| The number of threads | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 2 x 32 KB 4-way set associative instruction caches
2 x 32 KB 8-way set associative data caches |
| Level 2 cache size | 2 x 256 KB 8-way set associative caches |
| Level 3 cache size | 3 MB 12-way set associative shared cache |
| Physical memory | 8 GB |
| Multiprocessing | Not supported |
| Features | § MMX instructions
§ SSE / Streaming SIMD Extensions
§ SSE2 / Streaming SIMD Extensions 2
§ SSE3 / Streaming SIMD Extensions 3
§ SSSE3 / Supplemental Streaming SIMD Extensions 3
§ SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
§ AES / Advanced Encryption Standard instructions
§ EM64T / Extended Memory 64 technology / Intel 64
§ HT / Hyper-Threading technology
§ TBT / Turbo Boost technology
§ NX / XD / Execute disable bit
§ VT-x / Virtualization technology
§ VT-d / Virtualization for directed I/O
§ TXT / Trusted Execution technology |
| Low power features | § Thread C1, C3 and C6 states
§ Core C1/C1E, C3 and C6 states
§ Package C1/C1E, C3 and C6 states
§ Enhanced SpeedStep technology |
Integrated peripherals / components:
|
| Integrated graphics | GPU Type: HD (Westmere)
Base frequency (MHz): 500
Maximum frequency (MHz): 766
The number of supported displays: 2 |
| Memory controller | The number of controllers: 1
Memory channels: 2
Channel width (bits): 64
Supported memory: DDR3-800, DDR3-1066
Maximum memory bandwidth (GB/s): 17.1
ECC supported: No |
| Other peripherals | § Direct Media Interface
§ PCI Express 2.0 interface |
Electrical / Thermal parameters:
|
| V core | 0.8V - 1.4V (High Frequency mode)
0.775V - 1V (Low Frequency mode) |
| Minimum/Maximum operating temperature | 0°C - 105°C |
| Maximum power dissipation | 3.8 Watt (TDP in C6 state) / 67.2 Watt (peak, CPU core only)
44.8 Watt (sustained, CPU core only) |
| Thermal Design Power | 35 Watt (Package)
25 Watt (CPU core)
12.5 Watt (Graphics core) |
