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I5-6287U SR2JJ Intel Pc Processors Core I5 Series 4MB Cache Up To 3.5GHz

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I5-6287U SR2JJ Intel Pc Processors Core I5 Series 4MB Cache Up To 3.5GHz

Model Number : i5-6287U SR2JJ

Certification : ORIGINAL PARTS

MOQ : 1 piece

Price : Negotiation

Payment Terms : T/T, PayPal, Western Union, Escrow and others

Supply Ability : 1000pcs

Delivery Time : 3-5 work days

Packaging Details : tray, 10cmX10cmX5cm

Processor No. : I5-6287U

Product Collection : 6th Generation Core i5 Processors

Code Name : Skylake

Vertical Segment : Mobile

Status : Launched

Launch Date : Q3'15

Lithography : 14nm

Use Conditon : Industrial Commercial Temp, Embedded Broad Market Commercial Temp, PC/Client/Tablet

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Laptop CPU Processors I5-6287U SR2JJ Core I5 Series (4MB Cache,up to 3.5GHz ) - Notebook Processor

The Core i5-6287U is a dual-core SoC based on the Skylake architecture and has been launched in September 2015. The CPU can be found in medium-sized ultrabooks as well as normal notebooks. In addition to two CPU cores with Hyper-Threading clocked at 3.1 - 3.5 GHz (2 cores: max. 3.3 GHz), the chip also integrates an Iris Graphics 550 GPU with 64 MB of eDRAM memory as well as a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Processor number i5-6287U

Processor number	i5-6287U
Family	Core i5 Mobile
Technology (micron)	0.014
Processor speed (GHz)	3.1
L2 cache size (KB)	512
L3 cache size (MB)	4
The number of cores	2
EM64T	Supported
HyperThreading technology	Supported
Virtualization technology	Supported
Enhanced SpeedStep technology	Supported
Execute-Disable bit feature	Supported

General Information:

Type	CPU / Microprocessor
Market segment	Mobile
Family	Intel Core i5 Mobile
Model number	i5-6287U
Frequency	3100 MHz
Maximum turbo frequency	3500 MHz (1 core) 3300 MHz (2 cores)
Clock multiplier	31
Package	1356-ball micro-FCBGA
Socket	BGA1356
Size	1.65" x 0.94" / 4.2cm x 2.4cm
Introduction date	September 1, 2015 (announcement) September 27, 2015 (availability)
End-of-Life date	Last order date is October 26, 2018 Last shipment date is April 26, 2019

Architecture Microarchiteture:

Microarchitecture	Skylake
Processor core	Skylake-U
Core stepping	K1 (SR2JJ)
Manufacturing process	0.014 micron
Data width	64 bit
The number of CPU cores	2
The number of threads	4
Floating Point Unit	Integrated
Level 1 cache size	2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches
Level 2 cache size	2 x 256 KB 4-way set associative caches
Level 3 cache size	4 MB 16-way set associative shared cache
Level 4 cache size	64 MB
Physical memory	32 GB
Multiprocessing	Not supported
Extensions and Technologies	MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 AES / Advanced Encryption Standard instructions AVX / Advanced Vector Extensions AVX2 / Advanced Vector Extensions 2.0 BMI / BMI1 + BMI2 / Bit Manipulation instructions F16C / 16-bit Floating-Point conversion instructions FMA3 / 3-operand Fused Multiply-Add instructions EM64T / Extended Memory 64 technology / Intel 64 NX / XD / Execute disable bit HT / Hyper-Threading technology VT-x / Virtualization technology VT-d / Virtualization for directed I/O TBT 2.0 / Turbo Boost technology 2.0 TSX / Transactional Synchronization Extensions MPX / Memory Protection Extensions SGX / Software Guard Extensions
Low power features	Enhanced SpeedStep technology

Integrated peripherals / components:

Display controller	3 displays
Integrated graphics	GPU Type: Intel Iris 550 Graphics tier: GT3e Microarchitecture: Gen 9 LP Execution units: 48 Base frequency (MHz): 300 Maximum frequency (MHz): 1100
Memory controller	The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1
Other peripherals	PCI Express 3.0 interface (12 lanes) SATA controller USB controller USB OTG eMMC 5.0 SDXC 3.0 Legacy I/O

Electrical / Thermal parameters:

Maximum operating temperature	100°C
Thermal Design Power	28 Watt

Product Tags:

laptop chips

mobile processor laptop

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