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Celeron G3930 CPU Processor Chip Desktop CPU 2M Cache 2.90 GHz 14nm Lithography

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Celeron G3930 CPU Processor Chip Desktop CPU 2M Cache 2.90 GHz 14nm Lithography

Model Number : G3930

Certification : ORGINAL PARTS

MOQ : 1 PIECE

Price : Negotiation

Payment Terms : T/T, PayPal, Western Union, Escrow and others

Supply Ability : 500pcs/month

Packaging Details : Tray, 15cm X 15cm X 10cm

Processor No. : G3930

Product Collection : Celeron Processor G Series

Code Name : formerly Kaby Lake

Vertical Segment : Desktop

Stastus : Launched

Launch Date : Q1'17

Lithography : 14nm

Use Condition : Desktop/Server/Industrail PC

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Celeron G3930 is a 64-bit dual-core budget x86 desktop microprocessor introduced by Intel in early 2017. The G3930, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's improved 14nm+ process. This processor operates at 2.9 GHz with a TDP of 51 W and supports up to 64 GiB of dual-channel DDR4-2133 ECC memory. Additionally the G3930T incorporates Intel's HD Graphics 610 IGP operating at 350 MHz with a burst frequency of 1.05 GHz.

Processor number G3930:

Processor number	G3930
Family	Celeron Dual-Core
Technology (micron)	0.014
Processor speed (GHz)	2.9
L2 cache size (KB)	512
L3 cache size (MB)	2
The number of cores	2
EM64T	Supported
HyperThreading technology	Not supported
Virtualization technology	Supported
Enhanced SpeedStep technology	Supported
Execute-Disable bit feature	Supported

General information:

General information
Type	CPU / Microprocessor
Market segment	Desktop
Family	Intel Celeron Dual-Core
Model number	G3930
CPU part numbers	CM8067703015717 is an OEM/tray microprocessor BX80677G3930 is a boxed processor (English version) BXC80677G3930 is a boxed processor (Chinese version)
Frequency	2900 MHz
Bus speed	8 GT/s DMI
Clock multiplier	29
Package	1151-land Flip-Chip Land Grid Array
Socket	Socket 1151 / H4 / LGA1151
Size	1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date	January 3, 2017

Architecture / Microarchitecture:

Microarchitecture	Kaby Lake
Processor core	Kaby Lake-S
Core stepping	S0 (SR35K)
Manufacturing process	0.014 micron
Data width	64 bit
The number of CPU cores	2
The number of threads	2
Floating Point Unit	Integrated
Level 1 cache size	2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches
Level 2 cache size	2 x 256 KB 4-way set associative caches
Level 3 cache size	2 MB 8-way set associative shared cache
Physical memory	64 GB
Multiprocessing	Uniprocessor
Extensions and Technologies	MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 AES / Advanced Encryption Standard instructions EM64T / Extended Memory 64 technology / Intel 64 NX / XD / Execute disable bit VT-x / Virtualization technology VT-d / Virtualization for directed I/O MPX / Memory Protection Extensions SGX / Software Guard Extensions TSX / Transactional Synchronization Extensions
Low power features	Core C1/C1E, C3, C6, C7 and C8 states Package C2, C3, C6, C7 and C8 states Enhanced SpeedStep technology
Integrated peripherals / components
Display controller	3 displays DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4
Integrated graphics	GPU Type: Intel HD 610 Microarchitecture: Gen 9 LP Base frequency (MHz): 350 Maximum frequency (MHz): 1050
Memory controller	The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1333, DDR3L-1600, DDR4-2133 DIMMs per channel: 2 Maximum memory bandwidth (GB/s): 34.1 ECC supported: Yes
Other peripherals	Direct Media Interface 3.0 (4 lanes) PCI Express 3.0 interface (16 lanes)

Integrated peripherals / components:

Display controller	3 displays DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4
Integrated graphics	GPU Type: Intel HD 610 Microarchitecture: Gen 9 LP Base frequency (MHz): 350 Maximum frequency (MHz): 1050
Memory controller	The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1333, DDR3L-1600, DDR4-2133 DIMMs per channel: 2 Maximum memory bandwidth (GB/s): 34.1 ECC supported: Yes
Other peripherals	Direct Media Interface 3.0 (4 lanes) PCI Express 3.0 interface (16 lanes)

Electrical / Thermal

Maximum operating temperature	100°C
Thermal Design Power	51 Watt

parameters:

Product Tags:

computer cpu processor

multi core processor

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