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32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM

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Beijing Silk Road Enterprise Management Services Co.,LTD

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Model Number : H9TQ26ADFTACUR-KUM

Certification : Original Parts

MOQ : 1 piece

Price : Negotiation

Payment Terms : T/T, PayPal, Western Union, Escrow and others

Packaging Details : 10cm X 10cm X 5cm

Supply Ability : 500-2000pcs per month

Delivery Time : 3-5 work days

Part Numbe : H9TQ26ADFTACUR-KUM

Application : Mobile Phone

Product : eMCP

Density : 32GB

NAND Information : 32+24 eMCP-D3

Package Type : 221 ball FBGA

Dissipation Power : 5W

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EMCP Memory Chip H9TQ26ADFTACUR-KUM -32GNAND+24GLPD3 FBGA221 FW:A4-Embedded Multi-Chip Package NEW&ORIGINAL Storage

Featur and Description:

Part Number	Density	Organization	Temperature	Product Grade	Voltage	PKG	Product Status
H9TQ26ADFTACUR-KUM	32GB	SDP	1℃-100℃	IT	5v	FBGA221	Mass Production

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mcp memory

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