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I5-4278U SR1ZV Mobile Device Processors , Intel Core I5 Chip 3M Cache Up To 3.1 GHz

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I5-4278U SR1ZV Mobile Device Processors , Intel Core I5 Chip 3M Cache Up To 3.1 GHz

Model Number : I5-43278U SR1ZV

Certification : ORIGINAL PARTS

MOQ : 1 piece

Price : Negotiation

Payment Terms : T/T, PayPal, Western Union, Escrow and others

Supply Ability : 800pcs

Delivery Time : 3-5 work days

Packaging Details : Tray, 10cm X 10cm X 5cm

Processor Number : I5-4278U

Product Collection : 4th Generation Core i5 Processors

CodeName : Products formerly Haswell

Market Segment : Mobile

Status : Launched

Launch Date : Q3'14

Lithography : 22nm

Use Condition : Notebook/Mobile Device

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Mobile Device Processors I5-4278U SR189 ( 3M Cache, up to 3.1 GHz) - CORE I5 Processor Series Mobile /Notebook CPU

The Core i5-4278U is a LV (low voltage) dual-core processor for large ultrabooks launched in Q3 2014. It is based on the Haswell architecture and is manufactured in 22nm. Due to Hyper-Threading, the two cores can handle up to four threads in parallel, leading to better utilization of the CPU. Each core offers a base speed of 2.6 GHz, but can dynamically increase clock rates with Turbo Boost up to 3.1 GHz.

Model number naming conventions:

I5	Processor family: Core i5 Mobile
-
4	Processor generation: 4rd generation (Haswell)
2	Performance segment: Mid-class dual-core processors
78	Feature / Performance identifier
U	Additional features and market: Ultra low power CPU (15 Watt or 28 Watt)

Processor number i5-4278U

Processor number	i5-4278U
Family	Core i5 Mobile
Technology (micron)	0.022
Processor speed (GHz)	2.6
L2 cache size (KB)	512
L3 cache size (MB)	3
The number of cores	2
EM64T	Supported
HyperThreading technology	Supported
Virtualization technology	Supported
Enhanced SpeedStep technology	Supported
Execute-Disable bit feature	Supported

General Information:

Type	CPU / Microprocessor
Market segment	Mobile
Family	Intel Core i5 Mobile
Model number	i5-4278U
Frequency	2600 MHz
Maximum turbo frequency	3100 MHz (1 or 2 cores)
Bus speed	5 GT/s DMI
Clock multiplier	26
Package	1168-ball micro-FCBGA package (FCBGA1168)
Socket	BGA1168
Size	1.57" x 0.94" / 4cm x 2.4cm
Introduction date	July 20, 2014
End-of-Life date	Last order date for tray processors is July 1, 2016 Last shipment date for tray processors is January 6, 2017

Architecture / Microarchitecture:

Microarchitecture	Haswell
Platform	Shark Bay
Processor core	Haswell
Core stepping	C0 (SR1ZV)
Manufacturing process	0.022 micron
Data width	64 bit
The number of CPU cores	2
The number of threads	4
Floating Point Unit	Integrated
Level 1 cache size	2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches
Level 2 cache size	2 x 256 KB 8-way set associative caches
Level 3 cache size	3 MB 12-way set associative shared cache
Physical memory	16 GB
Multiprocessing	Uniprocessor
Extensions and Technologies	MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 AES / Advanced Encryption Standard instructions AVX / Advanced Vector Extensions AVX2 / Advanced Vector Extensions 2.0 BMI / BMI1 + BMI2 / Bit Manipulation instructions F16C / 16-bit Floating-Point conversion instructions FMA3 / 3-operand Fused Multiply-Add instructions EM64T / Extended Memory 64 technology / Intel 64 NX / XD / Execute disable bit HT / Hyper-Threading technology TBT 2.0 / Turbo Boost technology 2.0 VT-x / Virtualization technology VT-d / Virtualization for directed I/O
Low power features	Enhanced SpeedStep technology

Integrated peripherals / components:

Integrated graphics	GPU Type: Intel Iris 5100 Graphics tier: GT3 Microarchitecture: Gen 7.5 Execution units: 40 Base frequency (MHz): 200 Maximum frequency (MHz): 1100 The number of supported displays: 3
Memory controller	The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1333, DDR3L-1600, LPDDR3-1333, LPDDR3-1600 Maximum memory bandwidth (GB/s): 25.6
Other peripherals	Direct Media Interface 2.0 PCI Express 2.0 interface

Electrical / Thermal parameters:

Maximum operating temperature	100°C
Thermal Design Power	28 Watt

Product Tags:

powerful mobile processor

mobile microprocessor

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