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Model Number : K3RG3G30MM-MGCH
Certification : Original Parts
MOQ : 1 package
Price : Negotiation
Payment Terms : T/T, PayPal, Western Union, Escrow and others
Supply Ability : 6000pcs per month
Delivery Time : 3-5 work days
Packaging Details : 10cm X 10cm X 5cm
Item number : K3RG3G30MM-MGCH
Market : Mobile
Density : 3GB
Package : BGA336
DRAM Memory Chip K3RG3G30MM-MGCH 3GB LPDDR Memory Chip
Feature:
Lifecyle :Active
EU RoHS :Unknown
EU RoHS Version:2002/95/EC
Description: M-DIE LOW POWER DDR4 DRAM 24GB DENSITY Taxonomy
Memory > Memory Chips > DRAM Chip
Introduction Date:2016-01-19 00:00:00
ECCN:EAR99
Supplier Cage Code:1542F
Basic Package Type:Ball Grid Array
Package Family Name:BGA
Supplier Package:FBGA
Package Description:Fine Pitch Ball Grid Array
Lead Shape:Ball
Pin Count:366
PCB:366
Tab:N/R
Package Length (mm):N/A
Package Width (mm):N/A
Package Height (mm):N/A
Package Diameter (mm):N/R
Package Weight (g):N/A
Mounting:Surface Mount
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DRAM Memory Chip , K3RG3G30MM-MGCH 3gb Lpddr3 Memory Chip Storage Images |